Impedance matching device

摘要

The present invention intends to provide a small-sized impedance matching device with a small variation in quality and large-current tolerance. The above described intention of the present invention is achieved by an impedance matching device, which comprises a wiring portion comprising a conductor pattern for wiring, embedded inside or formed on the surface of first dielectric material, and either one or both of an inductor portion comprising a conductor pattern for inductor, embedded inside or formed on the surface of the first dielectric material, or a capacitor portion comprising at least one pair of conductor patterns for capacitor and second dielectric material with a dielectric constant larger than that of the first dielectric material, existing between the pair of conductor patterns for capacitor wherein the thicknesses of the conductor pattern for wiring and the conductor pattern for inductor are 20 μm or more.

主权项

1. An impedance matching device, which comprises:
a wiring portion comprising a conductor pattern for wiring, embedded inside or formed on the surface of a first dielectric material,
an inductor portion comprising a conductor pattern for inductor, embedded inside or formed on the surface of said first dielectric material, anda capacitor portion comprising at least one pair of conductor patterns for capacitor and a second dielectric material with a dielectric constant larger than that of said first dielectric material, existing between the pair of conductor patterns for capacitor; wherein a thicknesses of said conductor pattern for wiring and said conductor pattern for inductor are 20 μm or more, and wherein the wiring portion, the first dielectric material, the inductor portion, and the capacitor portion are tired to form a ceramic body.