发明名称 Low application temperature hot melt adhesive
摘要 High temperature performance hot melt adhesives are formulated for application at low temperature, i.e., below 300° F. Hot melt adhesive formed with metallocene polymer together with a maleated polyethylene wax show an excellent balance of high and low temperature performance and are particularly useful as packaging case and carton adhesive.
申请公布号 US8877305(B2) 申请公布日期 2014.11.04
申请号 US201213361197 申请日期 2012.01.30
申请人 Henkel US IP LLC 发明人 Patel Jagruti B.;Eodice Andrea Keys;Low Yew Guan
分类号 B32B1/02;C08L23/08;C09J123/08;C09J191/06;C08L91/06;C08L51/06 主分类号 B32B1/02
代理机构 代理人 Lehmann Sun Lee
主权项 1. A low application temperature hot melt adhesive comprising a polyolefin copolymer component and a maleated polyethylene wax component, wherein said polyolefin copolymer component comprises two different polyolefin copolymers comprising: (A) a first polyolefin copolymer that (i) is a metallocene-catalyzed ethylene/α-olefin copolymer prepared from ethylene and 1-octene monomers, and (ii) has a Melt Index of greater than about 400 g/10 min at 190° C.; and (B) a second polyolefin copolymer that (i) has at least about 50 mol % of ethylene content and (ii) has a Melt Index less than about 35 g/10 min at 190° C.
地址 Rocky Hill CT US