发明名称 |
Low application temperature hot melt adhesive |
摘要 |
High temperature performance hot melt adhesives are formulated for application at low temperature, i.e., below 300° F. Hot melt adhesive formed with metallocene polymer together with a maleated polyethylene wax show an excellent balance of high and low temperature performance and are particularly useful as packaging case and carton adhesive. |
申请公布号 |
US8877305(B2) |
申请公布日期 |
2014.11.04 |
申请号 |
US201213361197 |
申请日期 |
2012.01.30 |
申请人 |
Henkel US IP LLC |
发明人 |
Patel Jagruti B.;Eodice Andrea Keys;Low Yew Guan |
分类号 |
B32B1/02;C08L23/08;C09J123/08;C09J191/06;C08L91/06;C08L51/06 |
主分类号 |
B32B1/02 |
代理机构 |
|
代理人 |
Lehmann Sun Lee |
主权项 |
1. A low application temperature hot melt adhesive comprising a polyolefin copolymer component and a maleated polyethylene wax component,
wherein said polyolefin copolymer component comprises two different polyolefin copolymers comprising: (A) a first polyolefin copolymer that (i) is a metallocene-catalyzed ethylene/α-olefin copolymer prepared from ethylene and 1-octene monomers, and (ii) has a Melt Index of greater than about 400 g/10 min at 190° C.; and (B) a second polyolefin copolymer that (i) has at least about 50 mol % of ethylene content and (ii) has a Melt Index less than about 35 g/10 min at 190° C. |
地址 |
Rocky Hill CT US |