发明名称 Semiconductor devices
摘要 A semiconductor device and method of manufacturing a semiconductor device include a plurality of first active regions and a second active region being formed on a substrate. The second active region is formed between two of the first active regions. A plurality of gate structures is formed on respective first active regions. A dummy gate structure is formed on the second active region, and a first voltage is applied to the dummy gate structure.
申请公布号 US8878253(B2) 申请公布日期 2014.11.04
申请号 US201113099482 申请日期 2011.05.03
申请人 Samsung Electronics Co., Ltd. 发明人 Kim Hong-Soo;Shin Hwa-Kyung;Lee Moo-Kyung;Lim Jong-Ho
分类号 H01L27/118;H01L27/115;H01L21/28;H01L29/788;H01L29/423 主分类号 H01L27/118
代理机构 Onello & Mello, LLP 代理人 Onello & Mello, LLP
主权项 1. A semiconductor device, comprising: a substrate comprising a plurality of first active regions and a second active region disposed between two of the first active regions, the substrate being lightly doped with p-type impurities; an isolation layer on the substrate, the isolation layer defining the first and second active regions; a plurality of gate structures disposed respectively on the plurality of first active regions; a dummy gate structure disposed on the second active region, a first voltage being applied to the dummy gate structure, and an impurity region disposed in a portion of the second active region, a top surface of the impurity region being lower than a top surface of the substrate and a bottom surface of the impurity region being lower than a bottom surface of the isolation layer, and the impurity region contacting a lower portion of the isolation layer, being heavily doped with p-type impurities and having a first side contacting the isolation layer and a second side opposite the first side contacting the isolation layer such that the impurity region extends beneath the dummy gate structure.
地址 KR