发明名称 Cooling device for pluggable module, assembly of the cooling device and the pluggable module
摘要 Provides a cooling device (100) for cooling at least one pluggable module (200) each having a pluggable component (20) and a frame (32) for accommodating the pluggable component, the frame having an opening (33) on a top wall thereof. The cooling device comprises at least one thermal conductive block (40), a heat radiator (70) and a resilient thermal conductive pad (60). The resilient thermal conductive pad being adapted to be in a substantially released position when the pluggable component is decoupled from the frame and substantially biased when the pluggable component is inserted into the frame thus exerting a biasing force on the thermal conductive block and the heat radiator whereby the thermal conductive block is pressed through the opening of the frame into direct thermal contact with the pluggable element of the pluggable module for conducting the heat generated by the pluggable component to the heat radiator through the thermal conductive block and the resilient thermal conductive pad. The main advantage of the cooling device is that the pluggable module has a reinforced and compact cooling structure that improves the heat dissipation efficiency.
申请公布号 US8879262(B2) 申请公布日期 2014.11.04
申请号 US201013634958 申请日期 2010.03.29
申请人 Telefonaktiebolaget L M Ericsson (Publ) 发明人 Shi Kris
分类号 F28F21/00;F28F9/007;G02B6/42;H05K7/20;G01F1/20 主分类号 F28F21/00
代理机构 Coats & Bennett, PLLC 代理人 Coats & Bennett, PLLC
主权项 1. A cooling device for cooling at least one pluggable module, each pluggable module having a pluggable component and a frame for accommodating the pluggable component, the frame having an opening on a top wall thereof, the cooling device comprising: at least one thermal conductive block, each thermal conductive block configured to thermally couple to the respective pluggable module; a heat radiator for emitting heat generated by the pluggable component of the pluggable module outward; and a resilient thermal conductive pad arranged between the at least one thermal conductive block and the heat radiator; the resilient thermal conductive pad configured to be in a substantially released position when the pluggable component is decoupled from the frame, and to be substantially biased when the pluggable component is inserted into the frame thus exerting a biasing force on the thermal conductive block and the heat radiator whereby the thermal conductive block presses through the opening of the frame into direct thermal contact with the pluggable component of the pluggable module for conducting the heat generated by the pluggable component to the heat radiator through the thermal conductive block and the resilient thermal conductive pad.
地址 Stockholm SE