发明名称 MULTI LIGHT EMITTING DIODE PACKAGE
摘要 <p>PURPOSE: A multi light emitting diode package is provided to emit the light of white color and others by mounting the LED chip in one LED package. CONSTITUTION: The multi LED package(1) includes the first LED chip(12), the second LED chips(14,16), the heat sink(20), the lead frame(40), the housing(30), and the partition(22). The second LED chips emit the light different from the first LED chips. The heat sink releases heat by the mounting region of the first and the second LED chips. The lead frame is electrically wired to operate the first and the second LED chips. The housing supports the heat sink and lead frame. The partition is protruded at the upper part of the heat sin for the first LED chips.</p>
申请公布号 KR101456269(B1) 申请公布日期 2014.11.04
申请号 KR20080028793 申请日期 2008.03.28
申请人 发明人
分类号 H01L33/64;H01L33/62 主分类号 H01L33/64
代理机构 代理人
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