| 摘要 |
In one aspect, embodiments disclosed herein relate to a process for curing a thermoset composition, including: reacting a curable composition comprising an epoxy resin, an epoxy-reactive compound, and a catalyst, wherein there is a stoichiometric excess of the epoxy resin; to form an intermediate product having unreacted epoxy groups and secondary hydroxyl groups; and etherifying at least a portion of the unreacted epoxy groups and the secondary hydroxyl groups, catalyzed by the catalyst, to form a thermoset composition. |
