| 摘要 |
<p>The present invention relates to a photosensitive composition with enhanced light absorptivity suitable for forming fine patterns and, more specifically, to a photosensitive composition used for forming a hardened part in order to perform desired patterns by an integrated exposure method which exposes through an UV lamp and a photo mask, or by a direct writing method which uses light of the UV lamp or short wavelength laser light, and for developing an unhardened part using an alkali solution. Desirably, the present invention relates to the photosensitive composition and a hardened material therefrom having absorbance of 1.2-1.8 for a dried film with thickness of 25μm in the wavelength of 355-375 nm before exposure, and absorbance of 0.6 in the wavelength of 405 nm, and to a dried film which is obtained by drying after coating a carrier film with the composition.</p> |
