发明名称 DEVICE FOR DISCHARGING ADHESIVE ON SUBSTRATE
摘要 <p>PROBLEM TO BE SOLVED: To apply an adhesive on a substrate having odd number of substrate positions for one line or for one row easily and quickly, and to apply the adhesive on the substrate again easily when a discharge error is detected.SOLUTION: The device for discharging an adhesive on a substrate comprises a first discharge nozzle 4 and at least one second discharge nozzle 6 and can operate by two operation modes. The device is configured to perform following steps of: lifting a writing head 1 up so that the operation mode changes from one operation mode into the other operation mode; retreating or extending a pin 22; and declining the writing head 1 to predetermined operation height, in which tip ends of the discharge nozzles 4, 6 reach to substantially similar heights on the substrate in a state that the pin 22 is a retreated state, and the tip end of the at least one second discharge nozzle 6 reaches to height higher than that of the tip end of the first discharge nozzle 4 on the substrate in a state that the pin 22 is an extended state.</p>
申请公布号 JP2014205140(A) 申请公布日期 2014.10.30
申请号 JP20140079241 申请日期 2014.04.08
申请人 VESI SWITZERLAND AG 发明人 RUEDI GRUETER;CHRISTOF KOSTER;PAUL ANDREAS STADLER
分类号 B05C5/02;B05C11/10;C09J201/00 主分类号 B05C5/02
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