发明名称 |
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE |
摘要 |
<p>PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device.SOLUTION: In a semiconductor device 1, a semiconductor chip 8 mounted on a major surface of a package substrate 2 is sealed by a sealing member 11. On the major surface and a rear surface of the package substrate 2, wiring conductor patterns 4 are disposed and dummy conductor patterns 4 are also disposed in regions where the wiring conductor patterns 4 are not formed. Increasing the density of the conductor patterns 4 in the package substrate 2 in the above described manner reduces warpage and swell of the package substrate 2 which are caused by thermal treatment in the manufacturing processes of the semiconductor device 1.</p> |
申请公布号 |
JP2014207471(A) |
申请公布日期 |
2014.10.30 |
申请号 |
JP20140134944 |
申请日期 |
2014.06.30 |
申请人 |
RENESAS ELECTRONICS CORP;RENASAS NORTHERN JAPAN SEMICONDUCTOR INC |
发明人 |
TAKAHASHI NORIYUKI;SUZUKI MASAYUKI;TSUCHIYA KOJI;MATSUURA TAKAO;HASHIZUME TAKANORI;ICHITANI MASAHIRO;SUZUKI KAZUNARI;NISHIDA TAKAFUMI;IMURA KENICHI;MIWA TAKASHI |
分类号 |
H01L23/12 |
主分类号 |
H01L23/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|