| 摘要 |
A semiconductor device in which a resin electrode capacitor having a resin electrode is used as a chip capacitor (35) which is mounted so as to bridge two seating surfaces (21, 23) of a lead frame. As a result of this configuration, when the chip capacitor (35) is subjected to stress due to the difference in height between the seating surfaces (21, 23) or due to the pressure from a mold resin (7) during sealing, the resin electrode peels off, making it possible to prevent damage to the device substrate and prevent failure of the semiconductor device. |
