PRINTED CIRCUIT BOARD HAVING IMPROVED CHARACTERISTIC IMPEDANCE

摘要

An printed circuit board (14) includes a first insulative layer (140), a first conductive path (141), a second conductive path (142) and an insulative substrate (143) stacked together. The first conductive path is disposed between the insulative substrate and the first insulative layer. The first conductive path includes an engaging portion (146), a middle portion (148) having an end connected with the engaging portion, and a soldering portion (147) connected with an opposite end of the middle portion. The second conductive path is aligned with the middle portion of the first conductive path along a vertical direction, the second conductive path electrically connected with the middle portion of the first conductive path to increase a thickness thereon.

主权项

1. A printed circuit board comprising: a first insulative layer, a first conductive path, a second conductive path, and an insulative substrate stacked together, the first conductive path being disposed between the insulative substrate and the first insulative layer, the first conductive path comprising an engaging portion, a middle portion having an end connected with the engaging portion, and a soldering portion connected with an opposite end of the middle portion, the second conductive path aligned with the middle portion of the first conductive path along a vertical direction, the second conductive path being electrically connected with the middle portion of the first conductive path to define a combined thickness.