| 发明名称 |
POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, PASTE FOR FORMING FLUX COMPONENT INTRUSION-PREVENTING LAYER AND METHOD FOR BONDING BONDED BODY |
| 摘要 |
In a power module substrate, a circuit layer is formed on one surface of an insulating layer, a metal layer is formed on the other surface of the insulating layer, and a body to be bonded can be bonded to the other surface of the metal layer using a flux. A flux component intrusion-preventing layer containing an oxide and a resin is formed at a circumferential edge section of a bonding interface between the insulating layer and the metal layer. |
| 申请公布号 |
US2014318831(A1) |
申请公布日期 |
2014.10.30 |
| 申请号 |
US201214363437 |
申请日期 |
2012.12.11 |
| 申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
Nishikawa Kimihito;Nishimoto Shuuji;Kitahara Takeshi;Nagase Toshiyuki |
| 分类号 |
H05K13/00;B23K1/20;H05K13/04;H05K1/03;H05K1/02 |
主分类号 |
H05K13/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A power module substrate comprising an insulating layer, a circuit layer formed on a first surface of the insulating layer, and a metal layer formed on a second surface of the insulating layer,
wherein the metal layer has an another surface on which a body to be bonded can be bonded, and a flux component intrusion-preventing layer containing an oxide and a resin is formed at a circumferential edge section of a bonding interface between the insulating layer and the metal layer. |
| 地址 |
Tokyo JP |
