METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

This method for manufacturing a semiconductor device comprises: a fixation step wherein a plurality of semiconductor chips are mounted on and fixed to predetermined positions on the upper surface of a starting substrate that is to be formed into separate substrates; a connection step wherein electrodes of the plurality of semiconductor chips and electrodes of the starting substrate are connected to each other by wires; a sealing step wherein the entire lateral circumference of each semiconductor chip is sealed with a resin by means of resin potting among the plurality of semiconductor chips on the upper surface of the starting substrate; a bonding step wherein a starting protective cover, which is to be formed into separate protective covers, is bonded to the surface of the resin so that the starting protective cover extends over the plurality of semiconductor chips; and a cutting step wherein the assembly of semiconductor devices, which is obtained by bonding the starting protective cover to the starting substrate with the resin therebetween, is cut into separate semiconductor devices.