发明名称 Memory Cells and Methods of Making Memory Cells
摘要 Some embodiments include a memory cell having a data storage region between a pair of conductive structures. The data storage region is configured to support a transitory structure which alters resistance through the memory cell. The data storage region includes two or more portions, with one of the portions supporting a higher resistance segment of the transitory structure than another of the portions. Some embodiments include a method of forming a memory cell. First oxide and second oxide regions are formed between a pair of conductive structures. The oxide regions are configured to support a transitory structure which alters resistance through the memory cell. The oxide regions are different from one another so that one of the oxide regions supports a higher resistance segment of the transitory structure than the other.
申请公布号 US2014319444(A1) 申请公布日期 2014.10.30
申请号 US201414323839 申请日期 2014.07.03
申请人 Micron Technology, Inc. 发明人 Sandhu Gurtej S.;Pandey Sumeet C.
分类号 H01L45/00 主分类号 H01L45/00
代理机构 代理人
主权项
地址 Boise ID US