| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer separator capable of reliably separating a plurality of wafer groups formed by cutting a silicon ingot into each sheet of wafer after passing through a liquid and providing a next step therewith and to provide a process of manufacturing a wafer using the same.SOLUTION: The wafer separator includes in a liquid tank: a liquid current jetting nozzle (50) that jets a liquid current in a lateral direction toward a plurality of wafer groups W loaded in layers in a horizontal-state by cutting a silicon ingot; and an air bubble discharge device (60) that discharges and raises air bubbles toward a lower direction of the liquid current jetting nozzle between the liquid current jetting nozzle and the wafer groups W. |
