WAFER LEVEL ASSEMBLY OF A MEMS SENSOR DEVICE AND RELATED MEMS SENSOR DEVICE

摘要

An assembly of a MEMS sensor device envisages: a first die, integrating a micromechanical detection structure and having an external main face; a second die, integrating an electronic circuit operatively coupled to the micromechanical detection structure, electrically and mechanically coupled to the first die and having a respective external main face. Both of the external main faces of the first die and of the second die are set in direct contact with an environment external to the assembly, without interposition of a package.

主权项

1. MEMS sensor device assembly comprising:
a first die having an internal surface and an external surface, a micromechanical detection structure located on the internal surface; and a second die having an internal surface and an external surface, the second die integrating an electronic circuit operatively coupled to said micromechanical detection structure, the internal surface of the second die coupled to the internal surface of said first die, the external surfaces of the first and second dice being exposed outer surfaces of the assembly, and at least one of the external surfaces being configured to be placed in direct contact with a structure external to the assembly.