METHOD OF MOUNTING ELECTRONIC PART, CIRCUIT SUBSTRATE, AND IMAGE FORMING APPARATUS

摘要

The circuit substrate includes at least two lands formed on a substrate, wherein one electrode is to be mounted on the at least two lands, an electronic part having electrodes, one of the electrodes is soldered on the at least two lands with solders whose amounts are adjusted by a metal mask having at least two opening parts, positions of the at least two opening parts corresponding to the at least two lands when the solders are applied and melted, areas of the at least two opening parts being different with each other, wherein a height of one of the solders is different from a height of the other of the solders according to the difference of the areas of the at least two opening parts of the metal mask, whereby the electronic part is mounted on the circuit substrate in an inclined state.

主权项

1. A method of mounting an electronic part having electrodes on a circuit substrate having at least two lands on which one of the electrodes is to be mounted, wherein the method comprises:
preparing a metal mask having at least two opening parts, positions of the at least two opening parts corresponding to the at least two lands, areas of the at least two opening parts being different with each other; applying solders on the at least two lands through the at least two opening parts of the metal mask to adjust amounts of the solders by the differences of the areas of the at least two opening parts, placing the electrodes of the electronic part on the multiple lands; and melting the solders on the at least one land so that a height of one of the solders is different from a height of the other of the solders according to the amounts of the differences, whereby the electronic part is mounted on the circuit substrate in an inclined state.