WAFER CARRIER WITH VARYING THERMAL RESISTANCE

摘要

PROBLEM TO BE SOLVED: To provide a chemical vapor deposition apparatus that provides better temperature uniformity across the surface of each wafer, and better temperature uniformity across the entire wafer carrier.SOLUTION: A water carrier 32 has a top surface 34 holding wafers, and a bottom surface 36 heated by radiant heat transfer from a heating element 28. The bottom surface 36 of the wafer carrier is non-planar due to features such as depressions 54 so that the wafer carrier has different thickness at different locations. The thicker portions of the wafer carrier have higher thermal resistance. Differences in thermal resistance at different locations counteract undesired non-uniformity in heat transfer to the wafer. The wafer carrier may have pockets with projections for engaging separate locations on the edges of the wafer.