| 摘要 |
<p>The present invention provides a semiconductor device test apparatus comprising: a socket for testing a semiconductor device including a cover, a latch to press the upper surface of the semiconductor device, and a base which accommodates a contact pin and is coupled under the cover and in which a pair of accommodation holes is formed on one side of the base and the other side facing the one side; a DUT board electrically connected to the contact pin of the socket by being coupled with the socket for testing a semiconductor and in which a penetration hole is formed at a predetermined interval on a position corresponding to both sides of the DUT board; and a fixing member which fixes the DUT board and the base and comprises an upper shoulder unit and multiple elastic curve units vertically extended to the lower end of the shoulder unit. The upper shoulder unit of the fixing member is fixed on the accommodation hole of the base. The multiple elastic curve units fixes the DUT board to the base by being individually inserted into the penetration holes of the DUT board.</p> |
