Apparatus comprising and a method for manufacturing an embedded MEMS device

摘要

A system and a method for forming a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device includes a MEMS device having a first main surface with a first area along a first direction and a second direction, a membrane disposed on the first main surface of the MEMS device and a backplate adjacent to the membrane. The packaged MEMS device further includes an encapsulation material that encapsulates the MEMS device and that defines a back volume, the back volume having a second area along the first direction and the second direction, wherein the first area is smaller than the second area.

主权项

1. A method for making a device comprising:
encapsulating a transducer in an encapsulation material, the transducer comprising a substrate; and after encapsulating the transducer in the encapsulation material, etching the substrate of the transducer to form a transducer opening.