| 发明名称 | Cleaning nozzle for advanced lithography process | ||
| 摘要 | The present disclosure provides an apparatus for fabricating a semiconductor device. The apparatus includes a lithography tool. The lithography tool includes: a first nozzle configured to dispense a developer solution to a wafer; a second nozzle configured to dispense a cleaning solution to the first nozzle; and a controller configured to operate the second nozzle according to a predefined program. The present disclosure also provides a method of fabricating a semiconductor device. The method includes performing a developing process, wherein the performing the developing process includes dispensing a developer solution on a wafer using a first nozzle. The method also includes cleaning the first nozzle with a second nozzle, wherein the cleaning the first nozzle is executed according to one of a plurality of program recipes that each specify a sequence and a duration for which the first nozzle and the second nozzle are to be selectively activated. | ||
| 申请公布号 | US8873020(B2) | 申请公布日期 | 2014.10.28 |
| 申请号 | US201113216310 | 申请日期 | 2011.08.24 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Yang Ching-Hai;Li Shang-Sheng |
| 分类号 | G03B27/32;B05B17/04;H01L21/67;B05B15/02 | 主分类号 | G03B27/32 |
| 代理机构 | Haynes and Boone, LLP | 代理人 | Haynes and Boone, LLP |
| 主权项 | 1. An apparatus for fabricating a semiconductor device, comprising: a lithography tool that includes: a first nozzle configured to dispense a developer solution to a wafer;a second nozzle configured to dispense a cleaning solution to the first nozzle;an exhaust component configured to remove moisture, wherein the exhaust component includes a vacuum pump or a fan; anda controller configured to operate the second nozzle according to a predefined program and configured to operate the exhaust component to remove moisture from inside the lithography tool. | ||
| 地址 | Hsin-Chu TW | ||