| 发明名称 |
MEMS devices |
| 摘要 |
A method of manufacturing a MEMS device comprises forming a MEMS device element (12). A sidewall (20) is formed around the MEMS device element, and a sacrificial layer (14) is formed over the device element and within the sidewall. A package cover layer (16) is provided over the sacrificial layer, and the sacrificial layer is removed. This method provides additional sidewalls to the cap provided over the MEMS device. These additional sidewalls can then be deposited by a different process and be formed of a different material to the top part of the package cover layer. The sidewalls can prevent reflow of the sacrificial layer and improve the sealing properties of the sidewalls. |
| 申请公布号 |
US8872359(B2) |
申请公布日期 |
2014.10.28 |
| 申请号 |
US201013378240 |
申请日期 |
2010.06.24 |
| 申请人 |
NXP, B.V. |
发明人 |
Van Velzen Bart;Van Zadelhoff Hans;Verheijden Greja Johanna Adriana Maria |
| 分类号 |
H01L23/29;H01L21/14;H01L21/00;B81C1/00 |
主分类号 |
H01L23/29 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a MEMS device, comprising:
forming a MEMS device element on a substrate; forming a sidewall on the substrate around the MEMS device element; forming a thermally degradable sacrificial layer over the device element and within the sidewall; forming a package cover layer over the sacrificial layer and the sidewall, the package cover layer thereby covering and encapsulating the sidewall and defining a roof of a cavity, said package cover layer being porous to said thermally degradable sacrificial layer; and removing the sacrificial layer. |
| 地址 |
Eindhoven NL |
