发明名称 COMPONENT MOUNTING MULTILAYER WIRING BOARD
摘要 <p>PROBLEM TO BE SOLVED: To suppress the impact of noise between two electronic components by a simple and inexpensive configuration and method, without increasing the wiring layers of a multilayer wiring board, in a component mounting multilayer wiring board mounting at least two electronic components.SOLUTION: A component mounting multilayer wiring board comprises: a multilayer wiring board having a plurality of wiring layers disposed to face each other via an insulating layer, and an interlayer connector for electrically interconnecting the plurality of wiring layers; and a first electronic component and a second electronic component mounted in the multilayer wiring board or on the surface thereof. The component mounting multilayer wiring board is configured so that a first inner wiring layer of the plurality of wiring layers, located between the first and second electronic components, has a conductor pattern of a fixed potential disposed along the outer edge of the first electronic component and superposed thereon.</p>
申请公布号 JP2014203951(A) 申请公布日期 2014.10.27
申请号 JP20130078567 申请日期 2013.04.04
申请人 DAINIPPON PRINTING CO LTD 发明人 SAWADA KEISUKE;SAGARA HIDEJI
分类号 H05K3/46;H05K1/18 主分类号 H05K3/46
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