| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate assembly in which warpage does not occur even if a substrate assembly is formed by combining substrates having significantly different thermal expansion coefficients, and to provide a manufacturing method therefor.SOLUTION: A substrate assembly has a photosensitive glass substrate, and first and second substrates sandwiching both principal surfaces of the photosensitive glass substrate. One principal surface of the photosensitive glass substrate and the first substrate are thermally bonded, while the other principal surface of the photosensitive glass substrate and the second substrate are bonded. When the thermal expansion coefficient of the photosensitive glass substrate is C0, the thermal expansion coefficient of the first substrate is C1, and the thermal expansion coefficient of the second substrate is C2, the substrate assembly satisfies at least one relationship out of a relationship where C1/C2 is 0.7-1.3, a relationship where C0/C1 is less than 0.7 or larger than 1.3, and a relationship where C0/C2 is less than 0.7 or larger than 1.3. |
