CERAMIC ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a ceramic electronic component capable of preventing a stress based on bending from being transferred to a ceramic chip even when a substrate is bent by thermal shock or the like in the state where the ceramic electronic component is mounted on the substrate.SOLUTION: An external electrode 12 of a capacitor 10 includes: one first planar portion SEa that is a substantially rectangular contour positioned on a surface specifying a length dimension of a ceramic chip 11; and four second planar portions SEb which are substantially rectangular contours positioned on both surfaces specifying a height dimension of the ceramic chip 11 and both surfaces specifying a width direction and continued with the first planar portion SEa. The second planar portions SEb are formed from a printing metal film 12a deposited on an outer surface of the ceramic chip 11 and a plating metal film 12b deposited on an outer surface of the printing metal film 12a via an adhesion force mitigating film 12c.