| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a copper foil with a carrier in which an etching property is favorable, and thickness accuracy of a very thin copper layer on the carrier is favorable.SOLUTION: A copper foil with a carrier includes: a very thin copper layer which is made a square sheet of 10 cm, in which when an average value of a weight thickness measured value calculated by a weight thickness method is assumed Wand a thickness accuracy is P=3σ×100/Wwith a standard deviation assumedσ, Pis 3.0% or less; and an interlayer which includes Ni, in which when an insulation substrate is subjected to thermal compression bond to the very thin copper layer in ambient air, under the condition in which pressure:20 kgf/cm, at 220°C×2 hours, and the carrier is peeled in accordance with JIS C6471, an average value:A of a Ni coating weight of an interlayer side surface of the very thin copper layer is 400μg/dmor less when a Ni coating weight of the interlayer side surface of the very thin copper layer is measured at 10 points in a crosswise direction and a longer direction by a 20 mm spacing, and when a standard deviation of a Ni coating weight of the interlayer side surface of the very thin copper layer is assumedσand a coefficient of variation of the Ni coating weight is assumed X=σ×100/A, X satisfies 30.0% or less.</p> |
