A METHOD OF MANUFACTURING WIRING SUBSTRATE USING LASER BEAM

摘要

A method for manufacturing a wiring substrate using a laser beam comprises a superhydrophobic treatment step of performing a superhydrophobic treatment on a surface of a substrate; a hydrophilic patterning step of forming a hydrophilic pattern on the superhydrophobic treated surface of the substrate; a wiring step of placing a conductive solution on a position corresponding to the hydrophilic pattern; a step of forming a conductive wiring by drying the conductive solution; and a firing step of performing a heat treatment for the conductive wiring, wherein, in the hydrophilic patterning step, a laser beam is used to form the hydrophilic pattern into a desired pattern on the surface of the substrate. According to the present invention, by using the laser beam to directly form a desired circuit pattern on the surface of the substrate, a fine wiring with a line width less than 10μm can be formed.