ELECTROLYTIC COPPER FOIL, COPPER-CLAD LAMINATE, PRINTED WIRING BOARD AND ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide an electrolytic copper foil successfully inhibiting the occurrence of warpage of a rigid base material and good in handling ability even when the rigid base material is constituted by laminating rigid base materials, and a copper-clad laminate, a printed wiring board and an electronic component using the same.SOLUTION: There is provided an electrolytic copper foil having a Young's modulus of 35 GPa or more before a heating treatment, and the Young's modulus decreases to 30 GPa or less by the heating treatment at 200°C for 90 minutes.