发明名称 |
LIGHT SOURCE APPARATUS |
摘要 |
A light source apparatus of the present invention has a plurality of semiconductor laser devices and a holding member; the semiconductor laser device includes: a semiconductor laser element; a placing body on which the semiconductor laser element is mounted; a substrate on which the placing body is biased to one side thereof; and a pair of terminals electrically connected to the semiconductor laser element, biased to the other side of the substrate and protruding from the substrate, and the holding member includes: holes aligned in at least a pair of rows; a thin-walled section on which the holes are arranged, the thin-walled section being formed by providing at least a pair of depressions on the other side; and a thick-walled section provided adjacent to the thin-walled section. The semiconductor laser device is mounted on one side of the holding member and the placing body of the semiconductor laser device is disposed on the thick-walled section, and the pair of terminals are exposed through the holes from the other side of the holding member. |
申请公布号 |
US2014313715(A1) |
申请公布日期 |
2014.10.23 |
申请号 |
US201414257523 |
申请日期 |
2014.04.21 |
申请人 |
NICHIA CORPORATION |
发明人 |
MATSUO Hidenori;SASAMURO Takashi;KONDO Hideki |
分类号 |
F21K99/00 |
主分类号 |
F21K99/00 |
代理机构 |
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代理人 |
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主权项 |
1. A light source apparatus comprising a plurality of semiconductor laser devices and a holding member;
the semiconductor laser device comprising: a semiconductor laser element; a placing body on which the semiconductor laser element is mounted; a substrate on which the placing body is biased to one side thereof; and a pair of terminals electrically connected to the semiconductor laser element, biased to the other side of the substrate and protruding from the substrate, the holding member comprising: holes aligned in at least a pair of rows; a thin-walled section on which the holes are arranged, the thin-walled section being formed by providing at least a pair of depressions on the other side; and a thick-walled section provided adjacent to the thin-walled section, the semiconductor laser device is mounted on one side of the holding member and the placing body of the semiconductor laser device is disposed on the thick-walled section, and the pair of terminals are exposed through the holes from the other side of the holding member. |
地址 |
Anan-shi JP |