发明名称 |
SHIELD, PACKAGE STRUCTURE AND SEMICONDUCTOR PACKAGE HAVING THE SHIELD AND FABRICATION METHOD OF THE SEMICONDUCTOR PACKAGE |
摘要 |
A fabrication method of a semiconductor package is disclosed, which includes the steps of: providing a substrate having at least a carrying region and a cutting region defined on a surface thereof, wherein the cutting region surrounds the carrying region; disposing at least an electronic element on the carrying region of the substrate; disposing a shield having a recess portion and at least a positioning member extending outwards, on the carrying region of the substrate with the electronic element received in the recess portion and the positioning member extending outwards to the cutting region; and performing a cutting process along the cutting region to remove portions of the positioning member and the substrate. Therefore, the shield is precisely positioned on the substrate. |
申请公布号 |
US2014312473(A1) |
申请公布日期 |
2014.10.23 |
申请号 |
US201313919176 |
申请日期 |
2013.06.17 |
申请人 |
Siliconware Precision Industries Co., Ltd. |
发明人 |
Chung Kuang-Neng;Chung Hsin-Lung;Huang Tien-Chung;Hsu Tsung-Hsien |
分类号 |
H01L23/552;H01L21/56 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
1. A fabrication method of a semiconductor package, comprising the steps of:
providing a substrate having at least a carrying region and a cutting region defined on a surface thereof, wherein the cutting region surrounds the carrying region; disposing at least an electronic element on the carrying region of the substrate; disposing a shield having a recess portion and at least a positioning member extending outwards, on the carrying region of the substrate with the electronic element received in the recess portion and the positioning member extending outwards to the cutting region; and performing a cutting process along the cutting region to remove portions of the positioning member and the substrate. |
地址 |
Taichung TW |