ELECTRONIC DEVICE PACKAGE AND PACKAGING SUBSTRATE FOR THE SAME

摘要

An electronic device package, according to an embodiment of the present invention, comprises: an electronic device including a first electrode and a second electrode formed on one surface; and a package substrate having a first side in which an electronic device is mounted and a second side facing the first side. The package substrate includes: a first electrode pattern and a second electrode pattern electrically connected to the first electrode and the second electrode, respectively, on the first side; at least one via hole located outside the area in which the electronic device is mounted; and a concave-convex portion located adjacent to the via hole on the first side.