| 摘要 |
<p>Provided is a wafer transporting device which has an improved shock-absorbing structure capable of effectively absorbing external force to safely transport wafers. The wafer transporting device comprises a first frame; a storage unit which is connected to the first frame, is extended to the lower part of the first frame, and has a storage space formed to store the wafers; a second frame which is spaced apart from the first frame and the storage unit and interposed between the first frame and ground; one or more elastic members connecting the first and second frames; and one or more wheel units which are interposed between the second frame and ground and connected to the second frame. The second frame includes one or more support units that has one side connected to the elastic member and the other side connected to the wheel unit so that a load is delivered through the support units to the wheel units.</p> |
