| 发明名称 |
ELECTRONIC COMPONENT PACKAGE |
| 摘要 |
An electronic component package includes: a first insulation layer; an electronic component mounted in one surface of the first insulation layer; a heat sink formed with a cavity corresponding to the electronic component, bonded to the one surface of the first insulation layer to cover the electronic component, and formed with an inset hole and with an inlet hole; an adhesive charged in the cavity; and a circuit pattern formed in another surface of the first insulation layer. |
| 申请公布号 |
US2014313676(A1) |
申请公布日期 |
2014.10.23 |
| 申请号 |
US201414321214 |
申请日期 |
2014.07.01 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
KANG Joon-Seok;Yi Sung;Doh Jae-Cheon;Yoo Do-Jae;Kim Sun-Kyong;Baek Jong-Hwan |
| 分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic component package, comprising:
a first insulation layer; an electronic component mounted in one surface of the first insulation layer; a heat sink formed with a cavity corresponding to the electronic component, bonded to the one surface of the first insulation layer to cover the electronic component, and formed with an inset hole and with an inlet hole; an adhesive charged in the cavity; and a circuit pattern formed in another surface of the first insulation layer. |
| 地址 |
Suwon KR |
