| 摘要 |
Provided is a photosensitive resin composition which has excellent heat resistance, pore explosion resistance, empty foam resistance and crack resistance. A photosensitive resin composition of the present invention contains (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) a diluent solvent, (D) a compound that has two or more ethylenically unsaturated groups in each molecule and (E) a thermosetting component that has two or more cyclic ether groups and/or cyclic thioether groups in each molecule. This photosensitive resin composition is characterized in that: (A-1) a carboxyl group-containing resin which is obtained by reacting an esterified product of an epoxy group, said esterified product being produced by reacting (a) at least one kind of a bisphenol type epoxy compound and (b) an unsaturated carboxylic acid, with (c) a saturated or unsaturated polybasic acid anhydride is contained as the carboxyl group-containing resin (A); and the thermosetting component (E) has an average epoxy equivalent weight of 200 or more. |
