发明名称 METHOD AND APPARATUS FOR THINNING WAFER
摘要 A method and an apparatus for thinning a wafer are provided. The method for thinning a wafer, according to one embodiment of the present invention, comprises the steps of: irradiating a line beam focused at a specific depth of the wafer; scanning the wafer by using the line beam so as to form an interface at the specific depth of the wafer; and cleaving the wafer on which the interface is formed into a pattern wafer and a dummy wafer.
申请公布号 WO2014171649(A1) 申请公布日期 2014.10.23
申请号 WO2014KR02808 申请日期 2014.04.02
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 KIM, SUNG WOOK
分类号 H01L21/301;B23K26/00 主分类号 H01L21/301
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