| 发明名称 |
METHOD OF PROCESSING A DEVICE SUBSTRATE |
| 摘要 |
Methods of processing a device substrate are disclosed herein. In one embodiment, a method of processing a device substrate can include bonding a first surface of a device substrate to a carrier with a polymeric material. The device substrate may have a plurality of first openings extending from the first surface towards a second surface of the device substrate opposite from the first surface. Then, material can be removed at the second surface of the device substrate, wherein at least some of the first openings communicate with the second surface at least one of before or after performing the removal of the material. Then, at least a portion of the polymeric material disposed between the first surface and the carrier substrate can be exposed to a substance through at least some first openings to debond the device substrate from the carrier substrate. |
| 申请公布号 |
US2014315384(A1) |
申请公布日期 |
2014.10.23 |
| 申请号 |
US201414323329 |
申请日期 |
2014.07.03 |
| 申请人 |
Invensas Corporation |
发明人 |
Monadgemi Pezhman |
| 分类号 |
H01L23/00;H01L21/304 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of processing a device substrate, comprising:
a) bonding a first surface of a device substrate to a carrier with a polymeric material, wherein the device substrate has a plurality of first openings extending from the first surface towards a second surface of the device substrate opposite from the first surface; b) then removing material exposed at the second surface of the device substrate, wherein at least some of the first openings communicate with the second surface at least one of before or after performing step (b); and c) then exposing at least a portion of the polymeric material disposed between the first surface and the carrier substrate to a substance through at least some first openings to debond the device substrate from the carrier substrate. |
| 地址 |
San Jose CA US |
