| 摘要 |
PROBLEM TO BE SOLVED: To provide a photocurable resin composition which excels in adhesiveness to a substrate and flexibility, which has a low generation rate of cracks or warpage in a cured product and excellent resolution, and which is developable with an alkali aqueous solution, and to provide a photocurable dry film and a cured product of the composition, and a printed wiring board including these components.SOLUTION: The photocurable resin composition comprises (A) an alkali-soluble resin, (B) a photopolymerization initiator, and (C) a spherical silica filler having an average particle diameter of 300 nm or less, in which the (C) spherical silica filler having an average particle diameter of 300 nm or less is compounded by 60 mass% or more with respect to the total amount of the photocurable resin composition; and the composition is developable with an alkali aqueous solution. A photocurable dry film and a cured product of the composition, and a printed wiring board including these components are also obtained. |
