| 发明名称 |
INTEGRATED CIRCUIT SEALING SYSTEM WITH BROKEN SEAL RING |
| 摘要 |
The amount of signal propagation and moisture penetration and corresponding reliability problems due to moisture penetration degradation in an IC can be reduced by fabricating a wide seal ring with a channel having offset ingress and egress portions. |
| 申请公布号 |
US2014312466(A1) |
申请公布日期 |
2014.10.23 |
| 申请号 |
US201414322975 |
申请日期 |
2014.07.03 |
| 申请人 |
QUALCOMM Incorporated |
发明人 |
Frederick, JR. Norman;Myers Thomas Andrew |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A sealing system for an integrated circuit, comprising:
a seal ring circumscribing the integrated circuit, the seal ring including at least one channel having an ingress portion and an egress portion, the ingress portion being offset from the egress portion. |
| 地址 |
San Diego CA US |
