PLATING APPARATUS, PLATING METHOD, METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD

摘要

A voltage is applied between a stainless steel plate and an electrode such that the stainless steel plate is an anode, whereby a passive film formed at a portion to be plated of the stainless steel plate melts due to the reduction reaction and is removed. Thereafter, a voltage is applied between the stainless steel plate and the electrode such that the stainless steel plate is a cathode, whereby a plating underlayer is formed at the portion to be plated of the stainless steel plate from which the passive film is removed.

主权项

1. A plating apparatus for forming a plating layer at a surface of a member to be plated that includes a stainless steel, comprising:
a plating tank that stores an electrolytic solution; a first electrode provided in the plating tank; a second electrode provided in the plating tank; a first voltage applier that applies a voltage between the member to be plated and the first electrode such that the member to be plated is an anode; and a second voltage applier that applies a voltage between the member to be plated and the second electrode such that the member to be plated is a cathode, wherein the plating layer is formed at a predetermined portion to be plated by application of a voltage by the second voltage applier after a passive film is removed from the portion to be plated of the member to be plated by application of a voltage by the first voltage applier.