发明名称 |
ADHESIVE AGENT, AND METHOD FOR CONNECTING ELECTRONIC COMPONENT |
摘要 |
Provided are an adhesive agent capable of providing sufficient electrical continuity to a substrate to which a preflux treatment has been applied and a method for connecting electronic components. There is used an adhesive agent comprising a (meth)acrylate having an epoxy group in one molecule and a radical polymerization initiator having a one minute half-life temperature of 110 degrees C or more. A surplus adhesive agent component between terminals flows, whereby an imidazole component in a preflux, the component binding to an epoxy group of an epoxy group-containing acrylate, is drawn out thereby to be removed from a surface of the terminal. |
申请公布号 |
EP2792721(A1) |
申请公布日期 |
2014.10.22 |
申请号 |
EP20120857139 |
申请日期 |
2012.12.10 |
申请人 |
DEXERIALS CORPORATION |
发明人 |
ODAKA, RYOSUKE;SATO, DAISUKE |
分类号 |
C09J4/02;C08F220/32;C09J5/06;C09J163/10;H01R11/01;H01R43/00;H05K1/14 |
主分类号 |
C09J4/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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