| 摘要 |
An electronically functional yarn has a series of electronic devices 2 (e.g. silicon chips, signalling devices such as light, sound or symbol generators, or ultra thin electronic dice) on carrier fibres 6. Packing fibres 10 surround the devices 2 and their conductive interconnects 8. A retaining sleeve 12, which may be helically wound yarn 14 or woven or knitted braids, surrounds the packing fibres 10. The packing fibers 10 can be bonded together by adhesive or heating to provide a hermetic seal, e.g. to protect from washing, tumble drying and wear. A semiconductor chip 2 may be sealed in a polymeric micro pod 4. Interconnects 8 may be solder pads, attached to the carrier fibre using reflow soldering and fine copper wire. In making the yarn, electronic devices with interconnects are mounted on carrier fibres, the carrier fibres are fed through a channel with packing fibres around the sides to form a fibre assembly, e.g. using a carousel (20, fig 2). This is fed into a sleeve forming unit (24, fig 2), where filler material can also be added, in forming the sleeve 14 around the yarn. Pultrusion can be used to withdraw the sleeve. |
