发明名称 電子回路用途の多層フィルム
摘要 <p>The present disclosure relates to a multilayer film for electronic circuitry applications, having advantageous barrier properties against unwanted electron and electromagnetic wave interference, and also protection against dirt or other similar-type unwanted foreign matter interference. The multilayer films of the present disclosure have at least three layers. The first outer layer contains a polyimide base polymer, a carbon black filler and a dielectric filler. The core layer is a polyimide with less than 5 weight percent filler. The second outer is similar to the first outer layer and contains a polyimide base polymer, a low conductivity carbon black filler and a dielectric filler. The two outer layers can be the same or different. Optionally, additional layers can also be used between the two outer layers.</p>
申请公布号 JP5611993(B2) 申请公布日期 2014.10.22
申请号 JP20110553008 申请日期 2010.03.01
申请人 发明人
分类号 H05K3/28;B32B27/34 主分类号 H05K3/28
代理机构 代理人
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