发明名称 発熱体収納装置
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a heating element housing device which improves the cooling performance and achieves the downsizing. <P>SOLUTION: A partition plate 16 divides the interior into a heat radiation part 17 and a heating part 18, and a heating element 22 is provided at the heating part 18. The heat radiation part 17 is provided with a heat radiation plate 24 which collects heat generated from the heating element 22 using heat transfer means 25 to radiate the heat, and the partition plate 16 is provided with an opening 19 allowing the heating part 18 to communicate with the heat radiation part 17. The heat transfer means 25 penetrates through the partition plate 16 to allow the heating element 22 to communicate with the heat radiation plate 24. Air taken in from an air intake port 10a passes the heating part 18 and the opening 19 in this order and is sent from an air exhaust port 9a to the exterior after heat is absorbed by the heat radiation part 17. Thus, the cooling performance is improved and the downsizing is achieved. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5610000(B2) 申请公布日期 2014.10.22
申请号 JP20130006904 申请日期 2013.01.18
申请人 发明人
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项
地址
您可能感兴趣的专利