METHOD OF PREPARING AN ADHESIVE FILM INTO A PRECUT SEMICONDUCTOR WAFER SHAPE ON A DICING TAPE

摘要

A method for removing the trimmed scrap of conductive die attach adhesive film from a carrier support tape is provided. An adhesive film is disposed between a support carrier and a release liner; the release liner and adhesive film are cut into a shape conforming to the shape of a semiconductor wafer. After scrap release liner is removed, a temporary adhesive sheet is mounted over and adhered to the exposed conductive die attach film surrounding the cut shape, and mounted over and adhered to the scrap release liner on the cut shape; the temporary adhesive sheet is removed, and due to its adhesion properties to the adhesive film and release liner, the scrap adhesive film and scrap release liner are removed along with the temporary adhesive sheet.