发明名称 一体型溶融装置を備えた金型アセンブリ
摘要 <p>A platen-supported system (105) for use with a molding-system platen structure (107), the platen-supported system (105) comprising: a frame assembly (103) connectable with the molding-system platen structure (107); and at least one plasticating device (201) supported by the frame assembly (103). A molding system (100) having a mold frame assembly (203) configured for supporting a molding assembly (200), and the at least one plasticating device (201) located within the mold assembly (200).</p>
申请公布号 JP5612755(B2) 申请公布日期 2014.10.22
申请号 JP20130503782 申请日期 2011.03.26
申请人 发明人
分类号 B29C45/46;B29C45/03 主分类号 B29C45/46
代理机构 代理人
主权项
地址