发明名称 発熱素子の放熱構造
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat radiating structure and the like which can be easily assembled and has excellent a heat radiation property. <P>SOLUTION: A heat radiating structure comprises a substrate 5 disposed on the inner side of a cylindrical peripheral wall member 11, a plurality of FET 8 attached to the substrate 5 through a connection terminal 82 and aligned at a peripheral portion of the substrate 5, and an annular heat radiating spacer 7 fitted in the peripheral wall member 11. The spacer 7 has a leakage regulating portion 71 which is intermediate-fitted or clearance-fitted in the peripheral wall member 11, and a heat radiating portion 72 which is clearance-fitted in the peripheral wall member 11. The FET 8 are attached on the inner side of the spacer 7. On an outer peripheral surface of the heat radiating portion 72, a plurality of injection grooves 77 extending from a tip end toward the leakage regulating portion 71 is provided. A thermal-conductive material 100 is injected in a clearance 74 between the peripheral wall member 11 and the heat radiating portion 72. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5610284(B2) 申请公布日期 2014.10.22
申请号 JP20100216545 申请日期 2010.09.28
申请人 发明人
分类号 H01L23/36;H02K11/00;H05K7/20 主分类号 H01L23/36
代理机构 代理人
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