| 摘要 |
<p>A device for connecting areas of circuit pattern boards has flexible, stripline conductors (2, 2') surrounded by a dielectric (1, 5) and ground planes (8, 9; 6), a conductor laminate (a) comprising a substrate (1) and conductors (2, 2') etched on one of its surfaces and windows (3) cut between the conductors (2, 2') and a ground plane laminate (b) comprising a substrate (5) cut essentially similarly to the substrate (1) of the conductor laminate (a) with somewhat larger dimensions and a copper foil (6) arranged on one of the sides of the substrate (5), these being adhesively bonded to each other with the conductors (2, 2') of the conductor laminate (a) engaged with that side of the substrate (5) of the ground plane laminate (b) which is not covered by a foil. A metallization (8) is applied to the side of the device which is opposite to the foil covered surface of the ground plane laminate (b). This metallization (8) is electrically connected to said foil covered surface such that conductors (2, 2') and substrates (1, 5) are completely enclosed by an electrically conducting layer, the conductors thus being electrically shielded.</p> |
