| 摘要 |
<p>An addition curable silicone adhesive composition is provided. This composition does not require a curing furnace and exhibits excellent adhesion to resins and metals in a short period under room temperature conditions. This composition has blended therein an organic compound or an organosilicon compound having at least one (meth)acryl group in one molecule, an organohydrogenpolysiloxane having at least one monovalent aromatic group such as phenyl group, and an organosilicon compound having at least one hydrogen atom bonded to the silicon atom and at least one divalent to tetravalent aromatic group such as phenylene skeleton in one molecule.</p> |
