| 摘要 |
PURPOSE: An optical semiconductor device and a manufacturing method thereof are provided to prevent resin of a lead frame from going up by installing solder on a position in which the lead frame is projected. CONSTITUTION: An optical semiconductor device includes an optical semiconductor element, a lead frame(2), and a sealing resin unit(3). A lead frame installs the optical semiconductor element. The sealing resin unit covers the optical semiconductor element and an end of an optical semiconductor element installation side of the lead frame. The lead frame includes a reversal area(4) of an opposite area to the optical semiconductor element installation side instead of a bottom surface(3a) of the sealing resin unit. |
