| 发明名称 | Chips with high fracture toughness through a metal ring | ||
| 摘要 | A method of making an edge-reinforced microelectronic element is disclosed. The steps include mechanically cutting along dicing lanes of a substrate at least partially through a thickness thereof to form a plurality of edge surfaces extending away from a front surface thereof and forming a continuous monolithic metallic edge-reinforcement ring that covers each of the plurality of edge surfaces and extends onto the front surface. The front surface may have a plurality of contacts thereat and the substrate may embody a plurality of microelectronic elements. | ||
| 申请公布号 | US8865570(B2) | 申请公布日期 | 2014.10.21 |
| 申请号 | US201414146080 | 申请日期 | 2014.01.02 |
| 申请人 | Invensas Corporation | 发明人 | Mohammed Ilyas |
| 分类号 | H01L21/00;H01L29/66 | 主分类号 | H01L21/00 |
| 代理机构 | Lerner, David, Littenberg, Krumholz & Mentlik, LLP | 代理人 | Lerner, David, Littenberg, Krumholz & Mentlik, LLP |
| 主权项 | 1. A method of making an edge-reinforced microelectronic element, comprising: mechanically cutting along dicing lanes of a substrate at least partially through a thickness thereof to form a plurality of edge surfaces extending away from a front surface thereof the front surface having a plurality of contacts thereat, the substrate further including an exposed rear surface separated from the front surface by a semiconductor material and by wiring, the substrate embodying a plurality of microelectronic elements; and forming a continuous monolithic metallic edge-reinforcement ring covering each of the plurality of edge surfaces and extending onto the front surface. | ||
| 地址 | San Jose CA US | ||